Item Spec(mm) Application

Back Pad

1.0T Retain of semiconductor silicon wafers and LCD glass
1.5T

Polishing Pad

1.3T Primary polishing of semiconductor silicon wafers, LCD glass, optical lenses, metal, etc
1.6T Final polishing of semiconductor silicon wafers, LCD glass, optical lenses, metal, etc
 
Name Hong Duk, Choi Hyoung-il, Ahn Jung Min, Seo

e-Mail

hdchoi@daewon21.co.kr shoe@daewon21.co.kr jseo@daewon21.co.kr
Tel 031-372-3992(ext.107) 031-372-3992(ext.632) 031-372-3992(ext.220)